Summary: Polymeric thermosetting composites can be used as metal substitutes for certain applications if they possess high temperature stability in air, low coefficient of thermal expansion (CTE), and sufficient flexural strength, in combination with competitive costs. Commercial bismaleimide, bisnadimide, and cyanate ester thermosetting materials were selected due to their excellent thermal stability. Low CTEs were achieved by adding high loading levels of fused silica or silicon nitride fillers. Several optimized composites were fabricated by varying the materials, composition, and cure conditions. Characteristic composite properties, such as CTE, thermal stability, glass transition temperature (T_g), flexural strength, and filler distribution were investigated. The best system developed consists of Matrimide 5292, a commercial two-component bismaleimide resin, filled with 75% Silbond FW100EST, and additionally reinforced with 0.5% Twaron short fibers. This composite is distinguished by a CTE around 15 ppm · K⁻¹, a T_g around 340 °C, flexural strength above 100 MPa, and attractive material costs.

Two new diamino monomers based on 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) were synthesized and used in a low temperature polyamide polycondensation. High molecular weight homopoly(amide-imide)s and copoly(amide-imide)s were synthesized via in-situ silylation and investigated with respect to their solution, thermal, and film forming properties. All polymers are soluble in strong acids and most in amide type solvents. Inherent viscosities up to 7.4 dl/g in N-methyl-2-pyrrolidone (NMP)/LiCl were achieved. A methyl substitution in ortho-position to the imide group resulted in polymers possessing improved solubility and good thermal stability up to 500°C. Isotropic films can be prepared from solution.